FBSGAM01PC50 – EPC Space

Specifications

Parameters

Maximum operating voltage	50 V
Maximum operating current	12 A
On-state resistance (R_ds(ON))	7 milliohms, typical, 25ºC
Off-state leakage current	25 uA, typical, 25ºC
Operating frequency range	DC to 3MHz+
Maximum duty cycle	100%
V_BIAS Operating Range	4.75 to 5.25 V
Module V_BIAS Operating Current	10.5 mA, maximum
Switching times, typical, 25ºC, 10 A	td(on): 45 ns tr: 10 ns td(off): 45 ns tf: 12 ns
Operating temperature range	-40 to +85º C

Features

Fully de-rated 50 V/10 A device (output HEMT and Schottky rectifier rated at 100V, “C/R50” versions)
Fully de-rated 100 V/10 A device (output HEMT and Schottky rectifier rated at 200V, “C/R100” versions)
Single low-side power drivers with integrated high speed gate driver
Internal gate driver V_BIAS power supply over-voltage clamp for added protection
Integrated UVLO/Power Good detection and reporting circuitry
Power Good/(low-true) Shutdown bidirectional input/output
3.3 V compatible logic input
9 pin, low-profile over-molded SMT package with unique “pillar” I/O pads
Package dimensions: 0.75″L x 0.38″W x 0.125″H (maximum)
“Gan-Driving-GaN” technology
High efficiency

Description

EPC Space’s “GaN Driving GaN Technology” Series FBS-GAM01-P-C/R50/100 Single Low-Side Power Driver Module incorporates eGaN^® switching power HEMTs. These devices feature an integrated output clamp Schottky diode, and are
driven by a integrated high-speed gate driver consisting entirely of eGaN^® switching elements. Additionally, the 5 Vdc gate driver V_BIAS power supply is provided with over-voltage clamping protection along with under-voltage driver disable and reporting and contained in an innovative, space-efficient, 9 pin SMT over-molded epoxy package, covered under US Patent #10,122,274 B2.

The “C” version is the commercial development vehicle for engineering brassboard use or for demanding, non rad-hard industrial applications.
The “R” version is the RHA flight-ready, Commerce-rated EAR-99 Device.

Applications

Datasheet

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Technical Documents

FBS-GAM01-P-C50 Datasheet

Quality Documents

Parts are fully qualified per EPC Space stringent qualification requirements. Reports are available upon request. Please contact [email protected] for further information

Conflict Mineral Statement

Product Change Notice

PCN-2302 GAM Product Line Solder Dipping/Tinning

Screening Level

Development Parts

Parts that are assembled using same processes and line as space level parts but not screened and with no radiation hardness guarantee.

Radiation Hardened Parts

Radiation hardened units with space level screening.

Export Classification

ITAR Controlled? No

EAR? Yes

ECCN? 9A515.e

ECCN classification 9A515.e allows for the export of this product to many countries with no license required.

See Supplement No. 1 to Part 738 – Commerce Country Chart for countries with no “X” in column NS2.

FBS-GAM01-P-C50 – 50 V_DC/12 A Single Low-SidePower Driver Development Module

Specifications

Technical Documents

Quality Documents

Screening Level

Export Classification

Contact EPC Space

FBS-GAM01-P-C50 – 50 VDC/12 A Single Low-SidePower Driver Development Module

Specifications

Technical Documents

Quality Documents

Screening Level

Export Classification

Contact EPC Space

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FBS-GAM01-P-C50 – 50 V_DC/12 A Single Low-SidePower Driver Development Module