The EPCS5002PAC is a plastic QFN device with an exposed top for excellent thermal management. It is tailored to high frequency DC-DC motor drive applications.

The thermal resistance to case top is ~0.5 °C/W, resulting in excellent thermal behavior and easy cooling. The device features an enhanced PQFN “Thermal-Max” package. The exposed top enhances top-side thermal management and the side-wettable flanks guarantee that the complete side-pad surface is wetted with solder during the reflow soldering process, which protects the copper and allows soldering to occur on this external flank area for easy optical inspection.

Compared to a Si MOSFET, the footprint of 15 mm2 is less than half of the size of the best-in-class Si MOSFET with similar R_DS(on) and voltage rating, Q_G and Q_GD are significantly smaller and Q_RR is 0. This results in lower switching losses and lower gate driver losses. Moreover, EPCS5002PAC is very fast and can operate with deadtime less than 10 ns for higher efficiency and Q_RR = 0 is a big advantage for reliability and EMI. In summary, EPCS5002PAC allows the highest power density due to enhanced efficiency, smaller size, and higher switching frequency for smaller inductor and fewer capacitors.