The EPCS5001PA is a commercial plastic 3 x 5 mm QFN package with an exposed top for excellent thermal management. It is tailored to high frequency DC-DC applications to/from 40 V–60 V and 48 V BLDC motor drives.

The part has three variants:

1. EPCS5001PAC: COTS, with electrical screening at EPCS and visual inspection
2. EPCS5001PAV: TXV space-level screened part
3. EPCS5001PAS: Full S-level screened part

The thermal resistance to case top is ~0.2 °C/W, resulting in excellent thermal behavior and easy cooling. The device features an enhanced PQFN “Thermal-Max” package. The exposed top enhances top-side thermal management and the side-wettable flanks guarantee that the complete side-pad surface is wetted with solder during the reflow soldering process, which protects the copper and allows soldering to occur on this external flank area for easy optical inspection.